When you want to fill a section of your PCB with copper (i.e. to reduce the inductance on a signal, for increased thermal conduction, or to reduce the amount of copper you are going to have to etch away in an acid bath), you can use the command poly, or to select the polygon tool.
EAGLE Polygon tool
When thermals are ON, parts' pads that belong to the same net as the polygon will not be entirely enveloped by the copper pour, but instead will be connected to the polygon by conducting lines. This can be good, for instance, if you don't want a really solid thermal connection between the pad and the polygon (it can be hard to heat a pad up to soldering temperature if it is connected to a huge copper plane).
EAGLE Polygon with thermals ON
EAGLE Polygon with thermals OFF
In Altium Designer, I had trouble finding this feature. I tried pouring a polygon with this result:
Altium Designer polygon with default settings - thermals are ON
To turn that polygon into one solid copper area, I modified 2 settings
- Change the PCB Rules and Constraints
2. Change the properties of the polygon
Properties... > Net Options > Pour Over All Same Net Objects
And the result... thermals are off and you have a solid chunk of copper.
Altium Designer polygon with changed settings - thermals are OFF
As is generally the case, Altium has more options for polygon pours, which means there is more to figure out when you use it.
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